2026-07-19 20:56:15 +08:00
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# 封装与机械尺寸
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## 封装外形
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2026-07-18 00:51:43 +08:00
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## 封装参数
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2026-07-19 20:56:15 +08:00
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| 参数 | 规格 | 单位 |
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|:-|:-|:-|
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| 封装类型 | CSP-BGA | — |
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| 焊球间距 | 1.0 | mm |
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| 焊球直径 | 0.5 | mm |
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| 焊球数量 | 13 × 13 = 169 | 个 |
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| 基板尺寸 | 14.0 × 14.0 | mm |
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## 推荐焊接回流曲线
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| 阶段 | 温度范围 | 持续时间 | 单位 |
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|:-|:-|:-|:-|
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| 预热 | — | — | °C / s |
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| 恒温 | — | — | °C / s |
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| 回流峰值 | — | — | °C / s |
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| 冷却 | — | — | °C / s |
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<div class="note">
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推荐回流曲线参数待封装厂家提供后补充。
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</div>
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## 标识信息
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| 位置 | 内容 |
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2026-07-18 00:51:43 +08:00
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|:-|:-|
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2026-07-19 20:56:15 +08:00
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| 顶面 | 芯片型号、批号、生产日期 |
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| 底面 | — |
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<div class="note">
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芯片标识格式待确认后补充。
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</div>
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## 存储与搬运
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| 参数 | 规格 | 单位 |
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|:-|:-|:-|
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| 存储温度范围 | −65 ~ +150 | °C |
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| MSL 等级 | — | — |
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| 防潮包装要求 | — | — |
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<div class="note">
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MSL 等级和防潮要求待封装设计确认后补充。
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</div>
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