rbpu_datasheet/chapters/03_pin_description.md

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# 管脚描述
## 管脚顶视图
芯片配置,顶视图:
![pin_map](../assets/pin_map.png)
## 管脚定义表
@import "data/pin_name.csv"
## BGA 焊球位置表
下图列出了芯片 13 × 13 BGA 焊球阵列中每个位置的信号分配。
@import "data/pin_loc.csv"
### 封装信息
* 焊球中心间距1 mm
* 焊球大小0.5 mm
* 焊球数量13 × 13 = 169 个
* 基板大小1.4 cm × 1.4 cm