WangGY/报告/Z芯片测试报告_2609.md

7.5 KiB

Z芯片测试报告_2609

数字功能测试

AWG模块

ENV模式

out_

![ScreenImg (5)](./C:/Users/GS/Downloads/ScreenImg (5).png)

ScreenImg (5)

ScreenImg (18)ScreenImg (19)![ScreenImg (20)](./Z芯片测试报告_2609.assets/ScreenImg (20).png)![ScreenImg (21)](./Z芯片测试报告_2609.assets/ScreenImg (21).png)

TAIL_
ScreenImg (6)

ScreenImg (16)![ScreenImg (42)](./Z芯片测试报告_2609.assets/ScreenImg (42).png)![ScreenImg (23)](./Z芯片测试报告_2609.assets/ScreenImg (23).png)![ScreenImg (24)](./Z芯片测试报告_2609.assets/ScreenImg (24).png)![ScreenImg (25)](./Z芯片测试报告_2609.assets/ScreenImg (25).png)

MOD

COMMON
ScreenImg (8) ScreenImg (10)

![ScreenImg (9)](./Z芯片测试报告_2609.assets/ScreenImg (9).png)

![ScreenImg (11)](./Z芯片测试报告_2609.assets/ScreenImg (11).png)

![ScreenImg (12)](./Z芯片测试报告_2609.assets/ScreenImg (12).png)

![ScreenImg (13)](./Z芯片测试报告_2609.assets/ScreenImg (13).png)

![ScreenImg (14)](./Z芯片测试报告_2609.assets/ScreenImg (14).png)![ScreenImg (15)](./Z芯片测试报告_2609.assets/ScreenImg (15).png)

FREQ_(只有这一段)

![ScreenImg (27)](./Z芯片测试报告_2609.assets/ScreenImg (27).png)

![ScreenImg (28)](./Z芯片测试报告_2609.assets/ScreenImg (28).png)![ScreenImg (29)](./Z芯片测试报告_2609.assets/ScreenImg (29).png)![ScreenImg (30)](./Z芯片测试报告_2609.assets/ScreenImg (30).png)

![ScreenImg (31)](./Z芯片测试报告_2609.assets/ScreenImg (31).png)![ScreenImg (32)](./Z芯片测试报告_2609.assets/ScreenImg (32).png)![ScreenImg (33)](./Z芯片测试报告_2609.assets/ScreenImg (33).png)![ScreenImg (34)](./Z芯片测试报告_2609.assets/ScreenImg (34).png)

TAIL_(只有这一段)

![ScreenImg (35)](./Z芯片测试报告_2609.assets/ScreenImg (35).png)![ScreenImg (36)](./Z芯片测试报告_2609.assets/ScreenImg (36).png)![ScreenImg (37)](./Z芯片测试报告_2609.assets/ScreenImg (37).png)![ScreenImg (38)](./Z芯片测试报告_2609.assets/ScreenImg (38).png)![ScreenImg (39)](./Z芯片测试报告_2609.assets/ScreenImg (39).png)![ScreenImg (40)](./Z芯片测试报告_2609.assets/ScreenImg (40).png)![ScreenImg (41)](./Z芯片测试报告_2609.assets/ScreenImg (41).png)

NCO

TC_AWG_NCO_FREQ

1MHZ

![ScreenImg (43)](./Z芯片测试报告_2609.assets/ScreenImg (43).png)

101MHZ

![ScreenImg (44)](./Z芯片测试报告_2609.assets/ScreenImg (44).png)

201MHZ

![ScreenImg (45)](./Z芯片测试报告_2609.assets/ScreenImg (45).png)

![ScreenImg (46)](./Z芯片测试报告_2609.assets/ScreenImg (46).png)

301MHZ

![ScreenImg (47)](./Z芯片测试报告_2609.assets/ScreenImg (47).png)

401MHZ

![ScreenImg (48)](./Z芯片测试报告_2609.assets/ScreenImg (48).png)

501MHZ

![ScreenImg (50)](./Z芯片测试报告_2609.assets/ScreenImg (50).png)

601MHZ

![ScreenImg (51)](./Z芯片测试报告_2609.assets/ScreenImg (51).png)

701MHZ

![ScreenImg (52)](./Z芯片测试报告_2609.assets/ScreenImg (52).png)

801MHZ

![ScreenImg (53)](./Z芯片测试报告_2609.assets/ScreenImg (53).png)

TC_AWG_NCO_PHA

0deg

![ScreenImg (54)](./Z芯片测试报告_2609.assets/ScreenImg (54).png)

15deg

![ScreenImg (55)](./Z芯片测试报告_2609.assets/ScreenImg (55).png)

30deg

![ScreenImg (56)](./Z芯片测试报告_2609.assets/ScreenImg (56).png)

45deg

![ScreenImg (57)](./Z芯片测试报告_2609.assets/ScreenImg (57).png)

60deg

![ScreenImg (58)](./Z芯片测试报告_2609.assets/ScreenImg (58).png)

75deg

![ScreenImg (59)](./Z芯片测试报告_2609.assets/ScreenImg (59).png)

90deg

![ScreenImg (60)](./Z芯片测试报告_2609.assets/ScreenImg (60).png)

105deg

![ScreenImg (61)](./Z芯片测试报告_2609.assets/ScreenImg (61).png)

120deg

![ScreenImg (62)](./Z芯片测试报告_2609.assets/ScreenImg (62).png)

135deg

![ScreenImg (63)](./Z芯片测试报告_2609.assets/ScreenImg (63).png)

150deg

![ScreenImg (64)](./Z芯片测试报告_2609.assets/ScreenImg (64).png)

165deg

![ScreenImg (65)](./Z芯片测试报告_2609.assets/ScreenImg (65).png)

180deg

![ScreenImg (66)](./Z芯片测试报告_2609.assets/ScreenImg (66).png)

NCO_FM

TC_AWG_NCO_FM_FREQ

1MHZ

![ScreenImg (67)](./Z芯片测试报告_2609.assets/ScreenImg (67).png)

101MHZ

![ScreenImg (68)](./Z芯片测试报告_2609.assets/ScreenImg (68).png)

201MHZ

![ScreenImg (69)](./Z芯片测试报告_2609.assets/ScreenImg (69).png)

301MHZ

![ScreenImg (70)](./Z芯片测试报告_2609.assets/ScreenImg (70).png)

401MHZ

![ScreenImg (71)](./Z芯片测试报告_2609.assets/ScreenImg (71).png)

501MHZ

![ScreenImg (72)](./Z芯片测试报告_2609.assets/ScreenImg (72).png)

601MHZ

![ScreenImg (73)](./Z芯片测试报告_2609.assets/ScreenImg (73).png)

701MHZ

![ScreenImg (74)](./Z芯片测试报告_2609.assets/ScreenImg (74).png)

801MHZ

![ScreenImg (75)](./Z芯片测试报告_2609.assets/ScreenImg (75).png)

901MHZ

![ScreenImg (76)](./Z芯片测试报告_2609.assets/ScreenImg (76).png)

TC_AWG_NCO_FM_PHA

0deg

![ScreenImg (77)](./Z芯片测试报告_2609.assets/ScreenImg (77).png)

15deg

![ScreenImg (78)](./Z芯片测试报告_2609.assets/ScreenImg (78).png)

30deg

![ScreenImg (79)](./Z芯片测试报告_2609.assets/ScreenImg (79).png)

45deg

![ScreenImg (80)](./Z芯片测试报告_2609.assets/ScreenImg (80).png)

60deg

![ScreenImg (81)](./Z芯片测试报告_2609.assets/ScreenImg (81).png)

75deg

![ScreenImg (82)](./Z芯片测试报告_2609.assets/ScreenImg (82).png)

90deg

![ScreenImg (83)](./Z芯片测试报告_2609.assets/ScreenImg (83).png)

105deg

![ScreenImg (84)](./Z芯片测试报告_2609.assets/ScreenImg (84).png)

120deg

![ScreenImg (85)](./Z芯片测试报告_2609.assets/ScreenImg (85).png)

135deg

![ScreenImg (86)](./Z芯片测试报告_2609.assets/ScreenImg (86).png)

150deg

![ScreenImg (87)](./Z芯片测试报告_2609.assets/ScreenImg (87).png)

165deg

![ScreenImg (88)](./Z芯片测试报告_2609.assets/ScreenImg (88).png)

180deg

![ScreenImg (89)](./Z芯片测试报告_2609.assets/ScreenImg (89).png)

RAMP

FIXED

![ScreenImg (91)](./Z芯片测试报告_2609.assets/ScreenImg (91).png)

![ScreenImg (92)](./Z芯片测试报告_2609.assets/ScreenImg (92).png)

step

![ScreenImg (93)](./Z芯片测试报告_2609.assets/ScreenImg (93).png)![ScreenImg (94)](./Z芯片测试报告_2609.assets/ScreenImg (94).png)![ScreenImg (95)](./Z芯片测试报告_2609.assets/ScreenImg (95).png)

![ScreenImg (96)](./Z芯片测试报告_2609.assets/ScreenImg (96).png)

![ScreenImg (97)](./Z芯片测试报告_2609.assets/ScreenImg (97).png)

RAMP_SPI_FIXED_HEX

RAMP_SPI_STEP_HEX

![ScreenImg (98)](./Z芯片测试报告_2609.assets/ScreenImg (98).png)

模拟功能测试