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# 芯片尺寸
## 封装参数
| 参数 | 值 |
|:-|:-|
| 焊球中心间距 | 1 mm |
| 焊球大小 | 0.5 mm |
| 焊球数量 | 13 × 13 = 169 个 |
| 基板大小 | 1.4 cm × 1.4 cm |
| 封装类型 | CSP-BGA |